MCM Die Bonder at mcm-die-bonder.com

MCM Die Bonder at mcm-die-bonder.com: Datacon develops, produces and distributes back-end production equipment for the semiconductor market, called MCM Die Bonders.

The 2200 apm Multi Chip MCM Die Bonder is the current industry standard based on Datacon's previous PPS 2200 MCM Die Bonder platform, a revolutionary modular system introduced in 1995. The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market.